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Intel-Led Alliance Stirs Angst Over Wireless Spec's Future
By working outside of the IEEE's 802.11n next-generation task group, Intel has angered industry participants who accuse the Intel-led alliance of everything from co-opting the standards process to outright antitrust violations.
MANHASSET, N.Y. Intel has convinced fellow chip makers Broadcom, Atheros and Marvell to join forces outside of an IEEE wireless LAN group to develop an interoperable physical and media access control (MAC) layer scheduled to be presented for IEEE acceptance by November.
By working independently of the IEEE's 802.11n next-generation task group, Intel has angered task group members who accuse the Intel-led alliance of everything from co-opting the IEEE process to outright antitrust violations that could draw Federal Trade Commission (FTC) scrutiny.
Suspicions have been amplified by the PC-centric nature of the alliance as well as the secretive approach the group has taken, including the signing of nondisclosure agreements. The omission of Airgo Networks Inc. (Palo Alto, Calif.) from the alliance has also fueled accusations that the alliance is trying to offset Airgo’s competitive advantage.
Airgo is the only company shipping a multiple input, multiple output (MIMO) product. All agree that MIMO will be integral to whatever spec comes out of the 802.11n group,. Airgo is claiming a two-year advantage over competitors.
Intel's gambit comes at a critical time for the task group who's members are under customer pressure to complete next-generation WLAN implementations by early next year. Continued pressure from proliferating ultrawideband (UWB) options for video only add to the pressure.
The two groups backing proposals before the IEEE agreed to merge their efforts last July. They are working under a November deadline to complete a converged proposal. The groups are: WWiSE, which is led by chip makers Broadcom, Texas Instruments, STMicroelectronics and Airgo; and TGnSynch, led by Intel, Agere, Atheros and Marvell.
“It’s now a two-horse race to November,” said George Elantis, an engineering manager at STMicroelecronics (San Jose, Calif.), referring to the similar timelines the IEEE task group and the Intel-led alliance have set. “This [outside alliances] has been tried before, and while they say it’s to speed things up, I’m not convinced. But you can’t prevent it from happening,” he said.
Airgo President Greg Raleigh agreed that the Intel move would further delay the standards process.
Elantis also worries that the new alliance would not cater to core customers namely, handset manufacturers given its PC focus. Anuj Batra, a member of the technical staff at Texas Instruments, said he spoke with Intel about the plan and remains neutral. “We’ve taken a look . . . and we’re not in favor or against it,” he said.
"We would prefer an IEEE specification,” he added, which is important for the range of applications TI is targeting. Asked about antitrust accusations leveled against Intel in response to formation of the alliance, Batra responded, “Antitrust is always a concern.”
Intel, Atheros and Broadcom declined to comment, but Paramesh Gopi, general manager of Marvell Semiconductor Inc.’s Embedded and Emerging Business Unit (Sunnyvale, Calif.), defended the group’s approach. “We need to standardize on the codings and the basic elements of the MAC so that we have interoperability between all the silicon players and [achieve] some level of convergence into the specifications so we don’t have to keep stalling it and delaying it for commercial deployment," Gopi said.
The goal, he added, is to develop a baseline specification for laptops that allows them to implement a basic 2x3 or 4x4 MIMO system. "Keep in mind that we want the flexibility to discuss multicast and network and application-level interoperability to keep it extensible,” Gopi said. Extensibility will eventually include low-power modes for handsets. “Whatever gets done in the handset will probably fall out of what we’re doing here. We can’t alienate these guys as they’ll be the main drivers.”
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